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|a POSLANO DO SKCR
|b 2012-04-10
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|a 0-85296-039-5
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|a Silicon wafer bonding technology for VLSI and MEMS applications /
|c edited by Subramanian S. Iyer and Andre J. Auberton-Hervé.
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| 260 |
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|a London :
|b Institution of Electrical Engineers,
|c c2002.
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| 300 |
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|a xxv, 149 s. :
|b il.
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| 490 |
1 |
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|a EMIS processing series ;
|v no. 1
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| 500 |
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|a Obsahuje rejstřík.
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| 504 |
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|a Obsahuje bibliografie.
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| 650 |
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7 |
|a izolační materiály
|7 ph121255
|2 czenas
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| 650 |
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7 |
|a křemík
|7 ph122083
|2 czenas
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| 650 |
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|a silikony
|7 ph125528
|2 czenas
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| 650 |
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|a insulating materials
|2 eczenas
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| 650 |
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9 |
|a silicones
|2 eczenas
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| 650 |
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|a silicon
|2 eczenas
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| 655 |
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7 |
|a monografie
|7 fd132842
|2 czenas
|
| 700 |
1 |
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|a Iyer, Subramanian S.
|4 edt
|
| 700 |
1 |
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|a Auberton-Hervé, Andre J.
|4 edt
|
| 830 |
|
0 |
|a EMIS processing series ;
|v no. 1
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